The Hi-MO 7 66c adopts LONGi n-type TaiRay silicon wafers (wafer size 182.2 × 210mm), LONGi HPDC cell technology, and SMBB technology. It is designed according to the optimal module size of 2382 × 1134mm, with a module power range of 610W-625W and corresponding module efficiency of 22.6% -23.1%.

The first year degradation is 1%, and the annual degradation is 0.4%. The power temperature coefficient of Hi-MO7 product is -0.28%/° C, which is significantly lower than the TOPCon product on the market at -0.30%/°C.

At the same time, the low voltage design of Hi-MO7 66c can save BOS costs such as brackets and cables in most applications, such as tracker scenarios and scenarios with conventional wind speed. Thereby achieving a lower LCOE and higher customer value. The Hi-MO7 66c module inherits the advantages of the Hi-MO7 products: a higher bifaciality of 80% and a superior temperature coefficient of -0.28%/°C.

Additionally, the 66c module features characteristics such as low voltage and high current, which enable longer string number. This can lead to significant cost savings in most applications compared to 72c module, such as scenarios with conventional wind speed or combined with tracker. A cost reduction of 0.3￠/W can be achieved in tracker in Spain.